For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

The move toward 3D ICs and heterogeneous integration overcomes limitations of 2D scaling by integrating multiple specialized ...

Power delivery now spans stacked dies, interposers, bridges, and packages connected by thousands of micro-bumps and TSVs.

Although Taiwanese firms have largely missed the core AI chip development battlefield, a few with critical technological ...

This project models a basic inverting amplifier using Python code generated by an AI large language model. AI could help ...

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...

Imec has developed a impulse-radio UWM transmitter IC measuring 0.155mm², with a power consumption of less than 10 milliwatt (mW), fabbed in 28nm CMOS. The chip can accommodate data transfer rates of ...

Can MEMS become a mainstream technology? It certainly seems so now that microelectromechanical systems (MEMS) are being integrated with CMOS processes. As this trend continues grow, electronics ...

Taiwan's IC design sector is undergoing a decisive shift in 2026, with capital markets effectively validating an industry ...

A Centre of Excellence (CoE) will be established under the memorandum. Vice-chancellor Prof JP Pandey described the ...